Pan Solution Technologies Co., Ltd.

Product

Spot type
VWECER-2000
Assure wafer quality Measurement results reflecting defect density and dopant concentration.
Accurately measures surface and internal quality of wafers.
Improving wafer development efficiency Quality evaluation immediately after wafer slicing or wafer polishing provides quality information feedback in a short cycle.
Improving of defect rate Improve defect rate by early detection and elimination of defective wafers.
Ideal for selecting wafer suppliers.
VWECER-2000
Device Specification
●Size W900 × D900 × H700 mm
●Weight Approx.50 ㎏
●Power Single-phase AC 90 – 240 V
●Operating environment Temperature and Humidity 25±5℃・≦85％RH
Measurement Performance
●Measuring time 10sec or less / point
●Measuring method Probe contact type
●Sample size Up to 12inch
●Sample resistivity Up to 20.0 Ω・cm
●Measuring object p/n type Monocrystal
Measurement result (image)

In-line Type for Full Inspection
  • Corresponding to full inspection by connecting to the mass production line.
  • By customizing the number of wafers to be measured at the same time, inspection time can be shortened.

*build-to-order

Device Specification
●Size W2000 × D1500 × H1500 mm
●Weight Approx. 500 ㎏
●Power Single-phase AC 100 – 230 V
●Operating environment Temperature and Humidity 25±5℃・≦85％RH
Measurement Performance
●Measuring time 1sec / wafer
●Measuring method Probe contact type
●Sample size Up to 12inch
●Sample resistivity Up to 20.0 Ω・cm